Four high-performance front-end modules (FEMs) for next-gen Wi-Fi applications have been added to the product portfolio of RF Micro Devices Inc.
The RFMD RFFM8200, RFFM8500, RFFM8202 and RFFM8502 are integrated FEM solutions covering multiple Wi-Fi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. ??RFMD’s RFFM8200/8202 (2.5 GHz) and RFFM8500/8502 (5 GHz) FEMs integrate?the power amplifier, LNA and switch functionality into a single plastic QFN package.
Designed for both "chip on board" and "system-in-package" (SiP) implementations, both product families deliver linear output power while operating over a wide range of operating voltages. The highly integrated FEMs significantly reduce external component count outside the core Wi-Fi chipset.
The company cites statistics saying the Wi-Fi market is being driven by increasing consumer demand for access to mobile broadband data and the expanding operator?requirements for data offload to accommodate increased cellular and cable services. By 2015, it’s projected the Wi-Fi FEM mobile/embedded and consumer premises equipment markets will exceed $1.8 billion.
Says Rohan Houlden, general manager/Wireless Connectivity Business Unit, "RFMD’s newest Wi-Fi front end modules demonstrate industry-leading performance and are aligned with the industry’s leading Wi-Fi chipset providers on their most anticipated reference designs. By achieving superior linearity and dynamic EVM, RFMD’s Wi-Fi FEMs enable the proliferation of mobile broadband connectivity across an ever-expanding range of growth markets, including smartphones, tablets, notebooks, ultra-books, PCs, TV/video, e-readers, gaming and automotive."
Samples and production quantities are available now through RFMD’ online store or through local RFMD sales channels.