The AirPrime EM7700 embedded wireless module, touted by Sierra Wireless as “the world’s first thin form factor (TFF) embedded wireless module for 4G LTE networks, is 2.5 millimeters thick and is designed for use in ultraportable notebooks, tablets and other wireless device.
Made exclusively for connecting to the AT&T 4G LTE network, the AirPrime EM7700 is based on the AirPrime MC7700 module, which was certified by AT&T last year. Supporting Windows 8, the AirPrime EM7700 uses Qualcomm’s Gobi 4G LTE modem, the MDM9200, and it’s compatible with Qualcomm’s computing API and the USB-IF Mobile Broadband Interface Model (MBIM).
The module also offers a connectorized interface to enable build-to-order logistics, allowing manufacturers to offer it as an optional add-on to their devices. The AirPrime EM7700 supports HSPA+ on the AT&T network for use in areas where LTE is not yet available.