Trident Microsystems’ system-on-chip (SoC) and discrete semiconductor solutions target the digital home entertainment environment. Trident will be integrating Sensio Technologies’ 3D technology into its products to reflect industry demand for a high-end 3D viewing experience in the home. First among the Trident products to feature Sensio technology is the TV550 3D TV SoC, which will be followed by the release of new 3D chips, featuring Sensio 3D, for 3D TVs.

Sensio 3D is a proprietary, frame-compatible format for high-quality stereoscopic signal processing, easily integrated into TV products. Developed by Sensio more than ten years ago and deployed in the field for seven years, the technology has been used in commercial live 3D events produced around the world.

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FCC Launches Update to Broadband Health Map

The FCC updated its Mapping Broadband Health in America platform Friday to include new variables to better examine maternal health. Now, the platform allows users to visualize and survey

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