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Awards --
Call for Entries & Events:
CableFAX Program Awards
Call for Entries: June 21
Enter today!
CableFAXIES & Sales Executive of the Year Awards Breakfast
June 24
Register today!
Complete List of Events
Webinars:
Vine, Viggle, GetGlue:
Leveraging the Newest Social Media Apps to Drive Engagement and Brand Awareness
On-Demand
Capitalizing on Cloud Management and Navigation
Video On Demand Next Practices: Capitalizing on the Latest Innovations
On Demand
Killer Cable Apps: Using Online Games and Apps to Drive Consumer Engagement
On Demand
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DISH ON THIS. At the annual DISH Team Summit in San Antonio, TX, DISH retailers, partners and execs networked about the latest products in the satellite TV industry. Pictured are Christy Benson, Dir of Affiliate Marketing, Outdoor Channel, the net's Lee & Tiffany Lakosky, Hosts of “The Crush with Lee and Tiffany," DISH pres & CEO Joseph Clayton and Nathan Holm, Dir of Affiliate Sales & Marketing, Rocky Mountain Region, Outdoor Channel.
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May 30, 2012
Single-Chip Solution Assists In CFP2 Transition
Initial shipments of the Xilinx Inc. Virtex-7 H580T FPGA, which it says is the world’s first 3D heterogeneous all-programmable product, have begun. Key customers are the first to have access.
Virtex-7 HT devices use Xilinx’s stacked silicon interconnect (SSI) technology, and they feature as many as 16 28 Gbps and 72 13.1 Gbps transceivers, “making them the only single-chip solutions for addressing key Nx100G and 400G line-card applications and functions,” Xilinx says.
Combined with Xilinx’s 100G gearbox, Ethernet MAC, OTN and Interlaken IP, Virtex-7 HT devices help customers transition to CFP2 optical modules. “Driven by the migration to CFP2 and, in the future, CFP4 optical modules, Virtex-7 HT devices enable unprecedented integration capability for communication equipment vendors designing Nx100G and 400G line cards,” Xilinx adds.
“With eight 28 Gbps transceivers and ample logic capacity, the Virtex-7 H580T device is the only FPGA that can integrate additional line card functionality so that designers can implement a dual 100G OTN transponder on a single chip,” explains Mark Gustlin, system architect/Wired Communications at Xilinx. “Competing ASSP-based solutions will comprise five devices, will remain unavailable for more than a year, will consume at least 40-percent additional power and will cost 50-percent more.”
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